Electronic bonding white adhesive

It is mainly composed of adhesive and thermal conductive particles. Before curing, it is a paste like mixture. After curing, it solidifies under certain time and conditions. Our thermal-conducting silica gel is a one component room temperature vulcanized silicone rubber, which has a good bonding effect. Room temperature curing, simple curing conditions, repairable, curing thickness generally between 4-5mm. However, it is sensitive to the surface state of the radiator, and the binding force of the surface polluted device or radiator is weak. Strict on-site process control.



1. Environmental protection, non-toxic, non corrosive, in line with RoHS and reach instructions.
2. Excellent adhesion, fixation, insulation, sealing, moisture-proof, shockproof and aging resistance.
3. It can be firmly bonded with metal, glass, ceramic, plastic and other materials.
4. The cured silicone rubber has good electrical insulation performance, high and low temperature resistance, water and moisture resistance, aging resistance and long-term rubber elasticity.

performance index
Before curing: ① external view: white paste; ② product type: condensation type; ③ viscosity; MPa. S, 25 ℃): 30000-50000 & nbsp; ④ relative specific gravity (25 ℃): 1.55 & plusmn; 0.05
Operation performance: ① surface skinning time (min, 25 ℃): 3-8 & nbsp; ② curing time (min, 25 ℃): 8-12 hours (3-5mm); ③ curing time (min, 80 ℃)
After curing: ① hard (Shore A): 35-45 & nbsp; ② dielectric strength (kV / mm): & Ge; 15 & nbsp; ③ dielectric constant (100MHz): 3.5
&Nbsp; & nbsp; & nbsp; & nbsp; & nbsp; & nbsp; ④ volume resistivity & nbsp; (& omega; & middot; cm): & Ge; 1.0 & times; 1014 & nbsp; ⑤ elongation at break (%): 160-200 & nbsp; & nbsp; ⑥ tangent value of dielectric loss (1MHz): & le; 2.0 & times; 10-3
&Nbsp; & nbsp; & nbsp; & nbsp; & nbsp; & nbsp; ⑦ service temperature range (℃): - 50 ℃ - 180 ℃ & nbsp; ⑧ flame retardant grade: 94v0
The above mechanical and electrical properties were measured at 25 ℃ and 75% relative humidity after curing for 7 days.

It is mainly used for fixing, damping, bonding, insulation and other functions of electronic and electrical components. Such as switching power supply, lighting, transformer, circuit board, network transformer, etc.
Characteristic:
* this product is a single component organosilicon compound in white paste form.
* this product has good high and low temperature resistance, anti-seismic, anti corona, anti leakage insulation, corrosion resistance, weather resistance and other characteristics. After curing, the colloid can be used in a wide temperature range.
* no shrinkage during curing, good waterproof, moisture-proof and insulation performance.
* meet the requirements of EU ROHS directive.